Retained clamping elements
Elesa provides a range of products and solutions specifically developed to ensure that clamping elements remain securely integrated with the…
Advantech Introduces DPX S460: Empowering Gaming with AMD’s 8000 Series APU
Advantech unveils the DPX S460, leveraging AMD® Ryzen™ Embedded 8000 Series APUs to deliver exceptional graphics, AI capabilities, and…
Bob retires after three decades at Alloy Wire International
A long-serving wire specialist has retired after giving 30 years of service to one of the Black Country’s leading…
Innodisk Launches DDR5 7200 RDIMM with Industry-Leading Reliability for Advanced AI Workloads
The new RDIMM series enhances data processing efficiency and reliability, supporting on-premises confidential computing and data-intensive industrial workloads. Innodisk, a…
RealMan Unveils RealBOT Embodied Open Platform at IROS 2025
Next-gen human–robot teaming. At the recently concluded IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2025), RealMan Robotics made…
Lesters thinks out of the box with recruitment drive to solve the packaging skills shortage
Lesters Packaging is pressing the button on a significant recruitment drive as it looks to bridge the skills gap…
Next-Generation Vapour Degreasing Solvent For Medical Device Cleaning
Precision cleaning plays a crucial role in medical device manufacturing, reinforcing both product quality and patient safety….
Next-Generation of Optical Ethernet PHY Transceivers Deliver Precision Time Protocol and MACsec Encryption for Long-Reach Networking
Microchip’s new transceivers are offered at speeds up to 25Gbps to process more data CHANDLER, Ariz., October 30, 2025…
Danfoss launches Hybrid Load Control for hydrostatic propel applications, offering superior driving performance and robustness
Hybrid Load Control combines the behaviors of load-dependent and load-independent controls into one unit October 28, 2025 — NORDBORG,…
Anritsu Launches Virtual Network Measurement Solution to Evaluate Communication Quality in Cloud and Virtual Environments
– Accurately Measures Latency, Jitter, and Throughput Using Cloud-Based Software – Vienna, Austria – 28 October 2025 – ANRITSU CORPORATION…
CO Manufacturing aims to create the next generation with new Manufacturing Degree pathway
A leading manufacturer of home improvement products is looking to bridge a major skills gap by creating its own…
New software, new portfolio: the Eplan Platform 2026
More of Everything and Perfectly Customised. The new Eplan Platform: the foundation…
