C6C-RYZ8 COM Express Compact Type 6 module includes AMD Ryzen™ Embedded 8000 Series Processor.
Tria Technologies, an Avnet company specializing in embedded compute boards, introduces the Tria™ C6C-RYZ8 COM Express Compact Type 6 module, based on the AMD Ryzen™ Embedded 8000 Series processor, to its portfolio during Embedded World 2025.
This new member of Tria’s COM Express board family is based on AMD’s Zen 4 CPU architecture and provides a substantial performance improvement over previous board generations with AMD processors.
“The compact module is ideal for AI-based applications, and we are delighted to be unveiling it at Embedded World,” said Daniel Denzler, Senior Director, Business Line Manager, Tria Technologies. “This addition to our COM product portfolio with high performance x86 processors offers our customers even more choices from different industry standards and form factors, ranging from OSM and SMARC up to COM Express and COM-HPC, with a broad range of processor options and scalable compute performance.”
The C6C-RYZ8 COM Express Compact Type 6 is designed for applications that need high computational power, including AI-enhanced solutions at the edge, medical imaging, professional sound/video/light equipment, gaming platforms and many other demanding applications.
Making use of the powerful AMD Ryzen™ Embedded 8000 Series Processor and integrated AI accelerator (XDNA Neural Processing Unit), the module is available with a maximum of eight cores and 16 threads and up to six RDNA3 work group processors (WGP) for complex graphics operation and media data conversion.
With support for multiple screens, the space saving COM Express Compact form factor with Type 6 interface can accommodate up to 128GB board memory: local NVMe and versatile IO configurations.
Denzler added, “This addition provides our customers with a much broader choice of x86 compatible product options and benefits from the fact that the COM Express Compact Type 6 is a widely accepted industry standard used in countless applications. Designers developing system solutions based on the standard need look no further when the time comes to upgrade to future processing modules.”
Demonstrations of the COM Express Compact Type 6 and much more can be seen on Tria’s booth in Hall 3A Booth 225 during Embedded World from 11–13 March 2025 in Nuremberg, Germany.
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