As Europe races to establish a more self-sufficient and resilient semiconductor ecosystem, one often-overlooked technology is quietly making that ambition possible, photo-chemical etching (PCE). Against the backdrop of geopolitical tension, post-pandemic recovery, and surging demand for chips, the Micro Component Group — formerly micrometal Group and now comprised of micrometal GmbH, HP Etch, Etchform, and Thin Metal Parts Inc — is stepping forward as a strategic enabler of European semiconductor strength.
With its unmatched precision, repeatability, and ability to produce ultra-thin, complex metal components without tooling delays or mechanical stress, PCE is uniquely suited to support the semiconductor industry’s fast-moving, high-purity requirements. From microfilters and thermal management parts to shielding and wafer handling components, Micro Component Group is supplying critical elements that make chip production faster, cleaner, and more locally controlled.
“Europe is investing billions to bring semiconductor manufacturing home, but if we don’t solve the supply of precision components, we’re just reshuffling the bottlenecks,” says Jochen Kern, Head of Sales and Marketing at Micro Component Group. “PCE eliminates many of those barriers. We’re offering European fabs the flexibility, lead-time reduction, and design freedom they need to scale.”
Unlike traditional machining, PCE is tool-free and digitally driven, enabling near-instantaneous design changes and low-cost prototyping. That speed and adaptability are essential in a market where process nodes evolve rapidly and component requirements change overnight. By removing the lead-time burden and enabling local production of high-precision parts, Micro Component Group is helping to de-risk Europe’s ambitions.
And this goes beyond capacity. PCE offers unparalleled benefits in purity and precision, crucial for contamination-sensitive semiconductor processes. “With no heat-affected zones, no burrs, and no induced stress, PCE parts are clean and consistent,” adds Kern. “That’s why more chip manufacturers are turning to us as part of their quality-first strategies.”
As Europe’s industrial and political momentum builds around semiconductor independence, the Micro Component Group is proving that sometimes the biggest advances come from the smallest features. By etching reliability, flexibility, and speed into the foundations of chip manufacturing, the Group is helping Europe move from dependency to capability — one micron at a time.
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