(24th March 2025, Battle Creek, USA) AM Solutions – 3D post processing technology is set to make a major impact at Rapid + TCT 2025 in Detroit 8-10 April, presenting its advanced post-processing technologies for powder sieving and mixing, unpacking, support removal, cleaning and surface finishing of 3D printed metal and polymer parts at Booth 3216.
With a broad portfolio of automated finishing solutions, AM Solutions is a key enabler of scalable additive manufacturing (AM) for production applications, helping manufacturers transition to full-scale production with cost-effective, high-quality solutions. The company is rapidly expanding its presence in the U.S. market with a fully equipped 300,000 sq. ft. facility, providing post-processing solutions tailored for industrial AM users.
Dr. Tayfun Sigirtmac, CEO at Rösler / AM Solutions USA says, “As a trusted post-processing partner for major AM players like HP, Stratasys, and EOS, AM Solutions is setting new standards for automation, efficiency, and repeatability in AM production. Its solutions help manufacturers reduce post-processing times and costs, improve surface quality, and enhance the mechanical properties of printed components, promoting AM as a viable alternative to traditional manufacturing.”
Visitors to the AM Solutions booth will get an exclusive look at three of the company’s many leading post-processing solutions, each designed to simplify and automate critical post-build finishing steps.
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- IMG Rösler US
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- IMG CEC Rösler US
The United States-based branch of Rösler is headquartered in Battle Creek, Mich. The 300,000 sq. ft. facility houses manufacturing, warehousing, and production space as well as Customer Experience Center and training facilities capable of meeting and exceeding customer needs.
On show will be the C1 system is designed for photopolymer component post-processing, providing automated and cost-efficient resin removal with precise, repeatable results. With integrated process monitoring, the C1 ensures consistent support structure removal and a superior surface finish, making it ideal for functional components, intricate prototypes, and design objects requiring exceptional detail. Also at the show will be the M1 Basic which is a versatile surface finishing system engineered for small- to medium-sized AM production runs. It delivers consistent smoothing, deburring, and surface homogenization, handling a variety of part geometries and materials to improve part quality across different AM applications. Finally, visitors will see the S1 system, a 2-in-1 solution combining cleaning and surface finishing, particularly for powder bed fusion (PBF) parts. It offers automated cleaning and surface finishing in a single, compact machine, reducing processing time by over 60% while improving production efficiency for high-volume AM applications.
IMG S1
The S1 — a smart solution for cleaning and surface finishing, which set new standards for the post-processing of parts from powder bed fusion (PBF) AM technologies. In addition to the S1, the M1 Basic and the C1 will also be presented live at the AM Solutions booth
Transforming Additive Manufacturing: AM Solutions, HP, EOS, and Stratasys Collaborate on Cutting-Edge Post-Processing Solutions
AM Solutions will also highlight its strategic collaboration with EOS, which has resulted in the ongoing development of two groundbreaking post-processing systems: the D1 and F1. Designed for the EOS P3 series, including the new EOS P3 NEXT polymer printer, these solutions offer a fully automated workflow that streamlines unpacking, sieving, and powder mixing to ensure optimal material reuse and cost efficiency. By integrating automated unpacking and powder handling, the D1 and F1 systems minimize manual intervention and powder contamination, making them game-changers for scalable AM production. As EOS continues to advance polymer AM, AM Solutions’ post-processing expertise ensures that printed parts are finished to industrial-grade standards, supporting the transition from batch production to fully integrated serial manufacturing.
IMG AM Solutions D1 + F1
The post processing solution developed jointly by AM Solutions and EOS for the EOS P3 series, consisting of the D1 and F1 systems, enables a completely closed and efficient process for the post processing of SLS parts ready for series production. The workflow includes all steps from unpacking, sieving and mixing to direct feeding of the powder storage containers.
Moreover, the PowderEase T1, jointly developed by AM Solutions and Stratasys, will be showcased live at the Stratasys booth 2501. The collaboration between these two partners has resulted in an innovative 3-in-1 post-processing system for the Stratasys H350 SAF printer. The new PowderEase T1 combines unpacking, powder recovery, and powder dosing in a single unit, significantly simplifying workflows, reducing operating costs, and boosting overall productivity. One PowderEase T1 can serve up to six H350 printers, minimizing the need for additional equipment and labor. Compared to manual processes, the system saves up to 50 minutes per print job, delivering substantial time savings. Detailed information about the solution will also be available at the AM Solutions booth.
At Rapid + TCT 2025, you will receive detailed information about the jointly developed 3D Automatic Unpacking Station from HP and AM Solutions. This scalable, industrial-grade post-processing solution enables the fully automated and reproducible unpacking of additively manufactured components from the HP Jet Fusion 5 series in a continuous workflow. In addition to a significant increase in productivity and greatly improved cost efficiency, it also achieves a considerably higher powder reclaim rate, depending on the geometry of the component. More information will be available at the AM Solutions booth or at HP booth 2301.
IMG PowderEase T1
The PowderEase™ T1, a jointly developed 3-in-1 solution by AM Solutions and Stratasys, enables automated unpacking, powder recovery, and dosing for up to six H350 SAF printers in a single system. The solution will be on display at RAPID + TCT 2025 at the Stratasys booth. 2501
“AM Solutions is a proven global leader in AM post-processing technology,” says Sigirtmac. “With our 80-plus year heritage in surface finishing through our parent company, Rösler, and a state-of-the-art U.S. facility with an integrated Customer Experience Center where visitors can see our post-processing solutions in action, we provide not just equipment, but fully optimized, automated finishing solutions that enhance quality, consistency, and efficiency. We are proud to be a preferred partner for post-processing automation, working with industry giants like HP, Stratasys, and now EOS, to ensure that AM parts meet the highest performance and aesthetic standards. We invite all Rapid + TCT attendees to visit us at Booth 3216 to see firsthand how our technologies can transform their AM workflows.”
IMG Automatic Unpacking Station
The 3D Automatic Unpacking Station is a jointly developed solution by HP and AM Solutions. It is a scalable and consistent unpacking solution designed for the industrial-scale processing of parts printed using the HP Jet Fusion 5 series in a continuous workflow environment. More information will be available at the AM Solutions booth or at HP booth 2301.”
For manufacturers looking to scale AM production, reduce costs, and optimize post-processing efficiency, AM Solutions’ cutting-edge technologies and deep industry expertise provide an unmatched competitive advantage. Don’t miss the chance to see these innovations live — visit AM Solutions at Booth 3216 and take the next step toward seamless, automated AM post-processing.
For more information, visit www.solutions-for-am.com.
